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With the rapid advancement of generative AI, computing infrastructure, and high-performance computing demands, the global electronics industry is entering a new AI-driven structural growth cycle. According to forecasts by China Research and Intelligence, the global PCB market is expected to reach USD 96.8 billion in 2025, with a compound annual growth rate of approximately 5.8%, reflecting a notable acceleration in momentum.

On the technology front, high-density interconnect (HDI), IC substrates, advanced packaging substrates, substrate-like PCBs (SLP), and high-speed/high-frequency materials are becoming core pillars that support AI-related applications. At the same time, AI is reshaping the manufacturing landscape—empowering intelligent inspection, predictive maintenance, and smart scheduling to significantly enhance production efficiency and yield rates.

Driven by both surging demand and smart manufacturing, AI is not only expanding the scale of the PCB industry but also accelerating its transition toward higher value-added and more technologically advanced solutions. The 2026 HKPCA Show – International Electronics Circuit Exhibition (Shenzhen), themed “AI POWERS TECHNOLOGY”, will spotlight these transformative trends and help industry leaders seize emerging AI-driven opportunities.