One of the world’s largest and most influential exhibitions for the PCB and electronics assembly industry, the 2025 HKPCA Show, was successfully held from 3–5 December 2025.
Over three days, the Show brought together leading global enterprises to showcase innovative products and technologies, alongside high-level industry conferences and a wide range of networking activities. The event attracted professionals from around the world, generating vibrant business exchanges, new partnerships, and fruitful results.
600+ Leading Brands Gather Under One Roof
Highlighting the exhibition’s benchmark status
The HKPCA Show is committed to building an efficient platform for industry technology exchange and business cooperation. This year’s exhibition features nine themed zones, comprehensively showcasing the entire industry chain from “materials–manufacturing–assembly–testing & packaging.” More than 600 leading enterprises and emerging brands from China and abroad presented their latest products, technological achievements, and innovative solutions, collectively outlining a diverse ecosystem of the PCB supply chain.
Renowned exhibitors over the years include：
TOPSEARCH、SPRINT、SCHMOLL、DAIDALOS、YSPHOTECH、JADASON、C SUN、TZTEK、MIKOPTIK、WORLD WIDE、BONDTECH、KSDW、PROTEK、BEIJIA、KAIMA、ROSY、EAST SPACE LIGHT、SHENZHEN GALLON、JUCHE、UCE、MACHVISION、JIEJUN、EAGLE’OL、GHTECH、MKS’ ATOTECH、ZHENTIANWEI、HARVAR CHEMOTECH、SCREEN、LIH SHIANN ELECTRON、WKK、PROCESS AUTOMATION、KB、SCHMID、VEGA、GROUP UP、CFMEE、HOCSEN、BOFFOTTO、C&G、MINTEK、YINGHUA、XACT、ZEISS、AMIBA、BULLEFORCE, etc.
New exhibitors include：
DTECH、NISSHO、MINGYU、INJET、JINCUN、DO3THINK、TPA MOTION CONTROL、SENQUAN、GUANGDONG HAN STAR、JIANGXI QUST、INNOTECH、ZHONGYAO、YONGSHENGXIN、NANTONG HONGFLUOR、ZHEJIANG ZAILI、XIN PENG、MAIWD、JSTC LASER、WUXI WEIYI、BOOKA、SPRINGTEC、OMAR、HOMEYES、JIXIANG、OOTA、BAOFANG、KANGJUN、INSNEX、HECHUAN、ZHENG ZHI、WUYANG、SINOCERA, etc.
AI, glass substrates, high-frequency & high-speed, advanced packaging & testing, etc
A concentrated release of frontier products and technologies, showcasing the full industry chain at a glance.
During the exhibition, high multilayer boards, IC substrates, FPC, HDI, glass substrates, high-frequency and high-speed materials, as well as full-process semiconductor production solutions were showcased, bringing the latest technological developments and product displays to the industry. Through multidimensional and comprehensive presentations, the exhibition provided participating enterprises with opportunities to precisely capture market prospects.
Only accepted on
Overseas buyers gather
Global resources interconnected and accessible
International buyers from nearly 70 countries and regions—including South Korea, India, Japan, Malaysia, Singapore, Thailand, Iran, Vietnam, Saudi Arabia, Indonesia, the United States, Canada, Brazil, Germany, Italy, Poland, the United Kingdom, Nigeria, Hong Kong, and Taiwan—gathered at the event, unleashing strong purchasing potential. Concurrently, overseas visitor tour groups were organized, further facilitating efficient matchmaking between buyers and exhibitors.
Well-defined demand, abundant business opportunities
On-site deals and order negotiations kept flowing
Two major conferences and diverse activities held concurrently
Enhancing quality and expanding scope, gaining insights into the future trends of the industry
This year’s exhibition focuses on three key dimensions—Industry Insights × Networking × Business Cooperation—helping professionals capture trends, expand connections, and co-create business opportunities.
The International Technical and Smart PCB: AI Trends and Innovations Conference were successfully held concurrently. Nearly 40 high-level sessions focused on the industry’s directions of intelligence, high-end development, and sustainability, covering in depth topics such as digital transformation, smart manufacturing, advanced packaging, IC substrate processes, high-speed communications, new energy electronics, green manufacturing, and sustainable development. Numerous industry leaders and technical experts gathered, offering multidimensional perspectives on technology, markets, and trends, and providing participants with profound strategic insights and high-value knowledge sharing.
Moreover, a variety of social events—including the opening ceremony, welcome dinner, and golf tournament—successfully linked key players across the industry chain and promoted meaningful exchanges.
Wonderful moments continue, embarking again in 2026
“The conference extends its heartfelt gratitude to long-term partners, industry associations, exhibitors, visitors, and media friends who have continuously supported the development of the HKPCA Show
Looking ahead, the HKPCA Show will keep working closely with partners across the industry chain, deepening collaboration and unlocking the vast potential of the PCB/PCBA industry. We eagerly await your presence from December 2–4, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), to celebrate the industry’s next great chapter together.
2026 booth booking is in high demand!
Exhibit without delay—reserve your prime booth now.
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