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Author: Simon.Min@informa.com

HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch

05-08-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch

HKPCA & IPC Joint Webinar:IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision

31-07-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar:IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision

HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era

11-07-2025 14:00 – 17:00 HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era

HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias

27-06-2025 14:30 – 16:00 HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias

Over 3,000 booths have been booked! The booth selection meetings for the December HKPCA Show are in progress.

As one of the largest and most influential PCB and electronic assembly exhibitions in the world, the International Electronics Circuit (Shenzhen) Exhibition (HKPCA Show) will be grandly held from December 3 to 5, 2025, at Halls 5, 6, 7, and 8 of the Shenzhen World Exhibition & Convention Center (Bao’an)! This exhibition has been fully […]

[Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛

13-06-2025 13:30 – 17:00 [Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛

HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design

28-05-2025 14:30 – 16:00 HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design

The 2024 International Electronics Circuit Exhibition (Shenzhen)(HKPCA Show) has successfully concluded. Reserve your Booth for the 2025 HKPCA Show now!

HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits

16-05-2025 14:30 – 16:00 HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits

HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )

25-04-2025 14:30 – 16:00 HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )

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INFORMATION
About the Show
About Us
Exhibit Profile
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Why Exhibit
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