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HKPCA Seminars

HKPCA Seminars

To enhance the advancement to the PCB industry, monthly training courses will be held by Hong Kong Printed Circuit Association (HKPCA) to equip PCB engineers with the latest technologies and market trends.

27-06-2025

14:30 - 16:00

HKPCA Webinar - Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias

13-06-2025

13:30 - 17:00

[Chinese only] HKPCA研讨会 - 2025年PCB新技术与产业创新论坛

28-05-2025

14:30 - 16:00

HKPCA Webinar - High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design

16-05-2025

14:30 - 16:00

HKPCA Webinar - Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits

29-04-2025

14:30 - 16:00

HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series III (Advanced IC Substrate Development and Innovative Solutions )

25-04-2025

14:30 - 16:00

HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )

17-04-2025

14:30 - 16:00

HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series I (Total solution for glass substrates metallization with wet processes in advance packaging)

21-03-2025

14:30 - 16:00

HKPCA Webinar - Empowering New Industrialization with Artificial Intelligence Technology

12-11-2024

14:30 - 16:00

HKPCA Webinar - Design and solutions for three-dimensional assembly manufacturability

31-10-2024

14:30 - 16:00

HKPCA Webinar - AI, High Speed Digital, and High Power PCBs Technologies and Trends