HKPCA Seminars

HKPCA Webinar - Glass Interposer & Advanced Packaging Technology Evolution — Focus on Collaborative Innovation between Advanced Packaging and PCB

HKPCA Webinar - LIDE Technology More than TGV

HKPCA Webinar - High Precision Back Drill Study

HKPCA Webinar - Elaboration on ISO ESG Guidelines, WWF LCMP with Low Carbon Technologies & AI Applications for PCB Industry

HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch

HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision

HKPCA Seminar - Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era

HKPCA Webinar - Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias

[Chinese only] HKPCA研讨会 - 2025年PCB新技术与产业创新论坛

HKPCA Webinar - High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design