HKPCA Seminars
To enhance the advancement to the PCB industry, monthly training courses will be held by Hong Kong Printed Circuit Association (HKPCA) to equip PCB engineers with the latest technologies and market trends.
05-08-2025
14:30 - 16:00
HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch
31-07-2025
14:30 - 16:00
HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision
11-07-2025
14:00 - 17:00
HKPCA Seminar - Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era
27-06-2025
14:30 - 16:00
HKPCA Webinar - Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias
13-06-2025
13:30 - 17:00
[Chinese only] HKPCA研讨会 - 2025年PCB新技术与产业创新论坛
28-05-2025
14:30 - 16:00
HKPCA Webinar - High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design
16-05-2025
14:30 - 16:00
HKPCA Webinar - Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits
25-04-2025
14:30 - 16:00
HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )
17-04-2025
14:30 - 16:00
HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series I (Total solution for glass substrates metallization with wet processes in advance packaging)
21-03-2025
14:30 - 16:00
HKPCA Webinar - Empowering New Industrialization with Artificial Intelligence Technology
