HKPCA Seminar – AI Leads the Way to Innovation – PCB New Technology and Industry Innovation Forum 2026
15-05-2026 14:00 – 20:30 HKPCA Seminar – AI Leads the Way to Innovation – PCB New Technology and Industry Innovation Forum 2026 (In Chinese Only)
HKPCA Webinar – Server CPU/GPU BGA Coplanarity and Thermal Warpage Control
24-04-2026 14:30 – 16:00 HKPCA Webinar – Server CPU/GPU BGA Coplanarity and Thermal Warpage Control
Management of Emerging Contaminants and Environmental Regulatory Trends in the PCB Industry
10-04-2026 14:30 – 16:00 Management of Emerging Contaminants and Environmental Regulatory Trends in the PCB Industry
HKPCA Webinar – Glass Interposer & Advanced Packaging Technology Evolution —Focus on Collaborative Innovation between Advanced Packaging and PCB
20-03-2026 14:30 – 16:00 HKPCA Webinar – Glass Interposer & Advanced Packaging Technology Evolution — Focus on Collaborative Innovation between Advanced Packaging and PCB
HKPCA Webinar – LIDE Technology More than TGV
07-11-2025 14:30 – 16:00 HKPCA Webinar – LIDE Technology More than TGV
HKPCA Webinar – High Precision Back Drill Study
17-10-2025 14:30 – 16:00 HKPCA Webinar – High Precision Back Drill Study
HKPCA Webinar – Elaboration on ISO ESG Guidelines, WWF LCMP with Low Carbon Technologies & AI Applications for PCB Industry
19-09-2025 14:30 – 16:00 HKPCA Webinar – Elaboration on ISO ESG Guidelines, WWF LCMP with Low Carbon Technologies & AI Applications for PCB Industry
HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch
05-08-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch
HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision
31-07-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision
HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era
11-07-2025 14:00 – 17:00 HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era