HKPCA Webinar – LIDE Technology More than TGV
17-11-2025 14:30 – 16:00 HKPCA Webinar – LIDE Technology More than TGV
HKPCA Webinar – High Precision Back Drill Study
17-10-2025 14:30 – 16:00 HKPCA Webinar – High Precision Back Drill Study
HKPCA Webinar – Elaboration on ISO ESG Guidelines, WWF LCMP with Low Carbon Technologies & AI Applications for PCB Industry
19-09-2025 14:30 – 16:00 HKPCA Webinar – Elaboration on ISO ESG Guidelines, WWF LCMP with Low Carbon Technologies & AI Applications for PCB Industry
HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch
05-08-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch
HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision
31-07-2025 14:30 – 16:00 HKPCA & IPC Joint Webinar：IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision
HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era
11-07-2025 14:00 – 17:00 HKPCA Seminar – Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era
HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias
27-06-2025 14:30 – 16:00 HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias
[Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛
13-06-2025 13:30 – 17:00 [Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛
HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design
28-05-2025 14:30 – 16:00 HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design
HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits
16-05-2025 14:30 – 16:00 HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits