HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias
27-06-2025 14:30 – 16:00 HKPCA Webinar – Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias
[Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛
13-06-2025 13:30 – 17:00 [Chinese only] HKPCA研讨会 – 2025年PCB新技术与产业创新论坛
HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design
28-05-2025 14:30 – 16:00 HKPCA Webinar – High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design
HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits
16-05-2025 14:30 – 16:00 HKPCA Webinar – Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits
HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series III (Advanced IC Substrate Development and Innovative Solutions )
29-04-2025 14:30 – 16:00 HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series III (Advanced IC Substrate Development and Innovative Solutions )
HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )
25-04-2025 14:30 – 16:00 HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )
HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series I (Total solution for glass substrates metallization with wet processes in advance packaging)
17-04-2025 14:30 – 16:00 HKPCA Webinar – Innovative Glass Substrate Technology Webinar Series I (Total solution for glass substrates metallization with wet processes in advance packaging)
HKPCA Webinar – Empowering New Industrialization with Artificial Intelligence Technology
21-03-2025 14:30 – 16:00 HKPCA Webinar – Empowering New Industrialization with Artificial Intelligence Technology
HKPCA Webinar – Design and solutions for three-dimensional assembly manufacturability
12-11-2024 14:30 – 16:00 HKPCA Webinar – Design and solutions for three-dimensional assembly manufacturability
HKPCA Webinar – AI, High Speed Digital, and High Power PCBs Technologies and Trends
31-10-2024 14:30 – 16:00 HKPCA Webinar – AI, High Speed Digital, and High Power PCBs Technologies and Trends