HKPCA Seminars

To enhance the advancement to the PCB industry, monthly training courses will be held by Hong Kong Printed Circuit Association (HKPCA) to equip PCB engineers with the latest technologies and market trends.

05-08-2025

14:30 - 16:00

HKPCA & IPC Joint Webinar: Learn about the latest PCB universal design standard IPC-2221C from scratch

31-07-2025

14:30 - 16:00

HKPCA & IPC Joint Webinar:IPC-A-600 Acceptability of Printed Boards Redline Comparison of K to M Revision

11-07-2025

14:00 - 17:00

HKPCA Seminar - Solving High-Speed/High-Density Interconnect Challenges: Material and Glass Substrate Strategies for the Intelligent Era

27-06-2025

14:30 - 16:00

HKPCA Webinar - Explore of PCB Signal Integrity Based on AI Server Calculation Power Requirement — Signal Integrity Solutions of Vias

13-06-2025

13:30 - 17:00

[Chinese only] HKPCA研讨会 - 2025年PCB新技术与产业创新论坛

28-05-2025

14:30 - 16:00

HKPCA Webinar - High-Computing-Power Chip Packaging and Material Innovation: Breakthroughs in Substrate/Adhesive Film Technologies and Collaborative Simulation Design

16-05-2025

14:30 - 16:00

HKPCA Webinar - Failure Analysis Techniques in the New Era of AI: Infrared Thermography & X-ray CT Jointly Solve the Mystery of PCB Short Circuits

25-04-2025

14:30 - 16:00

HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series II (Primary Metallization for Glass Substrates )

17-04-2025

14:30 - 16:00

HKPCA Webinar - Innovative Glass Substrate Technology Webinar Series I (Total solution for glass substrates metallization with wet processes in advance packaging)

21-03-2025

14:30 - 16:00

HKPCA Webinar - Empowering New Industrialization with Artificial Intelligence Technology