Discover what’s next in PCBs, electronics assembly, semiconductors and AI-powered manufacturing
Under the theme “AI Powers Technology,” discover how AI is being applied across the PCB manufacturing workflow. Explore practical solutions that can help you build smarter production processes and move your business forward.
Meet more than 100 first-time HKPCA Show exhibitors bringing fresh ideas to HDI, IC substrates, high-frequency and high-speed base materials, through-glass via (TGV) glass substrates, and advanced packaging. Discover innovative processes and tailored technical solutions for your next manufacturing challenge.
and the latest solutions from industry leaders, including:
Nearly 40 concurrent events to inform your next move
- Hear from industry experts and senior executives at the International Technical Conference, Smart PCB: AI Trends & Innovative Technologies Conference and a wide range of focused summits. Gain insights into emerging technologies and discuss the issues shaping your business.
- New this year: the PCB + Advanced Semiconductor Packaging Innovation Forum and Advanced Electronic Packaging, Interconnection and System Integration Forum connects PCB production with semiconductor advanced packaging. Explore opportunities emerging as the semiconductor industry evolves.
- Continue the conversation at the Opening Ceremony, Welcome Dinner and Golf Tournament — relaxed settings to meet industry peers and build business connections.
Register early. Bring your team. Enjoy more benefits.
- Pre-register now for free admission.
- Enter weekly prize draws for a chance to win JD.com gift cards.
- Bring a group of four to enjoy group-visit benefits. Guangdong -based companies organizing groups of 30 or more may also apply for complimentary dedicated coach transfers.
▼ Planning a group visit? Contact us::
Contact: Ms. Archie Ping
Tel: 020-3758 3765 ext. 8032
Email: pr@hkpcashow.org
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